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Wafer Cleaning Machine Pcba

Our Wafer Cleaning Machine PCBA is specially designed for semiconductor wafer cleaning equipment. It integrates high-precision temperature control (±0.1℃), dynamic flow monitoring (response time <10ms) and anti-corrosion design (ceramic substrate + gold plating process), and is suitable for harsh cleaning environments such as ultra-pure water, SC1/SC2, etc. It has passed KC certification and K-REACH environmental compliance, and can be seamlessly integrated into mainstream Korean production lines such as Samsung and SK Hynix.

Fast Delievery
Quality Assurance
24/7 Customer Service

Product Introduction

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Core functions
Precision temperature control system:

Real-time monitoring of cleaning liquid temperature, control accuracy of ±0.1℃, to ensure no thermal stress damage on the wafer surface.
Supports multi-channel temperature feedback, suitable for ultrapure water (UPW), SC1/SC2 and other chemical cleaning processes.

Dynamic flow control:

Integrated high-sensitivity flow sensor, flow adjustment response time <10ms, to ensure cleaning uniformity.
Support flow range 0.5-20 L/min, compatible with Megasonic cleaning mode.

Corrosion-resistant design:

The PCB board adopts ceramic substrate + gold plating process, which can withstand strong acid/alkali (such as HF, H₂SO₄) environment.
Key interfaces are equipped with IP67 protection to prevent water vapor and chemical gas corrosion.

Data intelligence:

Built-in RS-485/Ethernet communication protocol, supports docking with factory MES system, and realizes cloud monitoring of cleaning parameters.

PCBA Manufacturing Capabilies

SMT Assembly Line	7 Lines
Capacity	48.2 Million Placements Per Month
Component Board	Max：550450MM Min:50MM50MM
Speed	0.15sec/chip 0.7sec/QFP
Wave- Solder	Max. PCB width: 550MM450 MM;Min：50MM50MM
Wave- Solder	Component height: Top 120 mm/Bot 15 mm
DIP Capacity	420 square meters per hour
Plug-in Equipment	PTH (Printed Through Hole) Machine. Non-standard Surface Mount Technology (SMT) Machine
Components	Passives Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP Double- Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement-Same Day Service
Test Equipment	FAI, X-RAY, SPI, ICT, FCT, AOI, 3D AOI, Burn-in, High-temperature Load
Box Build	Box Build Integration and Assembly
Quotation Document	Bill of Materials, Gerber Files, Pick-N-Place File(XYRS)
Turn Time	10 day Service to 30 Day Service
Quantity	No MOQ, Prototype PCB Assembly & Small Batch PCB Assembly & Wholesale PCBAS

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Why Choose TECOO

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It can be a challenge to find the optimal supplier for PCB Assembly – meeting each and all customers' expectations and requirements on price, quality, lead times, value-added services, and delivery. TECOO PCBA is confidant that we meet each and every expectations for your each PCB Assembly. Please contact us!

Company Profile

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Tecoo was founded in 2002 and has expertise in R&D and Electronic manufacturing(EMS). We deliver design, manufacturing, testing,box build,supply chain, and product management services. With abundant product development experience and vertically integrated manufacturing. we are committed to providing clients with innovative design services and joint development business models, to comprehensively and efficiently satisfy all of our customer's needs. Tecoo has high-powered leadership, a strong team of R&D, manufacturing, quality control, and sales service expertise, as well as a high degree of employee cohesion, and operates globally. Furthermore, we have combined the EMS and ODM industries to become an emerging Design and Manufacturing Service (DMS) company. Consequently, we are able to offer industry-leading, state-of-the-art products and strategic business opportunities for our customers.

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