RE3200 AI Vision Intelligent Computing Chip For Edge AI Applications

Key Advantages

• Highly integrated architecture combining CPU, AI, video, audio, and security subsystems
• Multi-core heterogeneous computing for parallel task execution and intelligent resource scheduling
• Configurable hardware acceleration modules to support customized development

AI & Performance

• Integrated dedicated AI accelerator delivering up to 0.6 TOPS
• Supports mainstream deep learning models for real-time vision inference
• Optimized power design achieving up to 300% improvement in computing efficiency
• Typical ultra-low power operation for always-on edge devices

Power Consumption

• Peak power consumption: <45 mA @ 25°C
• Deep sleep mode (GPIO or timer wake-up): <10 µA

Interfaces & Connectivity

• Rich peripheral support including MIPI-CSI, HDMI, USB 3.0, and Ethernet
• Flexible I/O configuration to meet diverse system integration requirements

Reliability & Operating Conditions

• Ambient temperature: -40°C to 85°C
• Junction temperature: -40°C to 125°C
• ESD protection: 4 kV (HBM)
• Latch-up immunity: 200 mA

Process & Packaging

• 55 nm low-power process (1P7M)
• QFN40L package, 5 mm × 5 mm × 0.75 mm, 0.4 mm pitch

Power Supply

• Single external 3.3 V supply (3.0 V–3.6 V)
• Integrated 3.3 V–1.2 V and 3.3 V–1.8 V LDOs

Target Applications

• Smart surveillance systems
• Intelligent transportation
• Industrial machine vision
• Smart home and IoT devices

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